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Element with routing structure in bonding layer
US Patent US20230005850A1
Co2 sensor and method of sensing co2
US Patent US20220365048A1
Direct bonding and debonding of carrier
US Patent US20220320036A1
Direct bonding and debonding of carrier
US Patent US20220319901A1
Fluid sensor system
US Patent US20230149608A1
Expansion control for bonding
US Patent US20230299029A1
Diffusion barriers and methods of forming same
US Patent US20230132632A1
Direct bonding and debonding of elements
US Patent US20230197496A1
Structure with conductive feature for direct bonding and method of forming same
US Patent US20230197453A1
Low temperature direct bonding
US Patent US20230361074A1
Heat dissipating system for electronic devices
US Patent US20230245950A1
Expansion controlled structure for direct bonding and method of forming same
US Patent US20230343734A1
Bonded structure and method of forming same
US Patent US20240105674A1